Using the example of the UI-388xLE, the specifications for maximum temperatures, mounting, shield and ESD protection are provided. The listed data is applicable for all uEye LE USB 3.1 Gen 1 board level versions.

Temperature management

Fig. 354: Temperature information

Assembly information

The uEye LE USB 3.1 Gen 1 camera can only be assembled from back to front.

Fig. 355: Mounting details

Assembly hole attachment

Fig. 356: Assembly hole attachment

ESD protection

•For optimum ESD behavior, a clearance of 4 mm from non-shielded housings must be maintained all the way around. For shielded housings, a smaller clearance is possible.

•The board should be attached to a support connected to the shield using the fixing screws. If this is not possible, an insulating connection must be ensured.

•The connecting cable should have a low-resistance shield on both sides.

Fig. 357: ESD protection