Notes on PCB version USB uEye LE

uEye Camera Manual Version 4.92


Notes on PCB version USB uEye LE

Using the example of the UI-124xLE, the specifications for maximum temperatures, mounting, shield and ESD protection are provided. The listed data is applicable for all USB uEye LE board level versions.

Temperature management

Fig. 500: Temperature information

Fig. 500: Temperature information

Assembly information

The USB uEye LE cameras can be screwed on both sides.

Fig. 501: Mounting details

Fig. 501: Mounting details

Assembly hole attachment

Fig. 502: Assembly hole attachment

Fig. 502: Assembly hole attachment

ESD protection

•For optimum ESD behavior, a clearance of 4 mm from non-shielded housings must be maintained all the way around. For shielded housings, a smaller clearance is possible.

•The board should be attached to a support connected to the shield using the fixing screws. If this is not possible, an insulating connection must be ensured.

•The connecting cable should have a low-resistance shield on both sides.

Fig. 503: ESD protection

Fig. 503: ESD protection

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