The specifications for maximum temperatures, mounting, shield and ESD protection are provided. The listed data is applicable for all uEye SE USB 3.1 Gen 1 board level versions.

Temperature management

Fig. 371: Temperature information

Assembly information

The uEye SE USB 3.1 Gen 1 board level version with front can either be assembled using the two holes on the underside of the front or using the four holes on the front panel. Attaching the front to the camera shield is only possible with the two options shown.

Fig. 372: Mounting via front (1)

Fig. 373: Mounting via front (2)

For versions without front, assembly is possible using two screws from the rear through the board level. The following figure shows the assembly with S-board. The transport protection (two nuts and locking plate) must be removed first. The sensor board can then be separated from the board level and assembled. The board level is then re-fitted on the sensor board and screwed on.

Fig. 374: PCB version with S-board

The following figure shows the assembly with L-board.

Fig. 375: PCB version with L-board

ESD protection

•For optimum ESD behavior, a clearance of 4 mm from non-shielded housings must be maintained all the way around. For shielded housings, a smaller clearance is possible.

•The board should be attached to a support connected to the shield using the fixing screws. If this is not possible, an insulating connection must be ensured.

•The connecting cable should have a low-resistance shield on both sides.

Fig. 376: ESD protection